Title :
Definition of the mechanical stress value in the IC pin leads
Author :
Pavlysh, Volodymyr ; Dyachok, Dmytro
Author_Institution :
Inst. of Telecommun., Radioelectron. & Electron., Nat. Univ. Lvivska Polytechnica, Lviv, Ukraine
Abstract :
The stressed state of the rigid connection of the IC chip and wiring substrate is presented. The mechanical stresses in the IC golden and soldered pin leads are calculated by the corrected formula. It is shown that with the increase of lead numbers the calculation accuracy by the proposed formula is increased.
Keywords :
integrated circuit testing; stress analysis; IC pin leads; mechanical stress value; rigid connection; soldered pin; wiring substrate; mechanical stress; pin lead;
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2008 Proceedings of International Conference on
Conference_Location :
Lviv-Slavsko
Print_ISBN :
978-966-553-678-9
