Title :
VLSI package reliability risk due to accelerated environmental testing
Author :
Haupert, David ; Chen, Fu-Gin ; Lee, David
Author_Institution :
Control Data Corp., St. Paul, MN, USA
Abstract :
The use of accelerated environmental testing as part of the printed circuit board manufacturing process has been shown to trigger a corrosion-related failure mode. The authors present details of failures observed on advanced ceramic packages used to house CMOS VLSI components. Key factors to be considered before implementing accelerated environmental test programs are discussed
Keywords :
CMOS integrated circuits; VLSI; corrosion; environmental testing; integrated circuit testing; life testing; packaging; printed circuit testing; reliability; CMOS; VLSI; accelerated environmental testing; ceramic packages; corrosion-related failure; package reliability risk; printed circuit board manufacturing; Ceramics; Circuit testing; Corrosion; Humidity; Life estimation; Manufacturing processes; Packaging; Printed circuits; Silver; Very large scale integration;
Conference_Titel :
Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
Conference_Location :
Washington, DC
DOI :
10.1109/TEST.1989.82390
