Automated inspection of solder joints on PC boards by supplementary processing of 3D and gray-level images

Author

Mengel, P.

Author_Institution

Siemens AG, Munich, Germany

fYear

1990

Firstpage

786

Abstract

High-resolution, 3-D detection of the surface coordinates of printed circuit boards using optical 3-D sensors, combined with an available intensity image, offers a reliable way of judging the quality of wave-soldered components in through-hole and surface-mounting technologies. Global, 3-D pattern-recognition techniques, supported by gray-level operations that detect local disturbances in the brightness curve, produce a very comprehensive picture of the geometric shape and surface properties of solder joints. The capabilities of these methods are demonstrated for an automated solder-joint tester than can be integrated into the material and information flow of the production line. Results for recognition accuracy and processing speed are given

Keywords

automatic optical inspection; computerised picture processing; manufacturing computer control; printed circuit manufacture; soldering; surface mount technology; 3D images; PC boards; geometric shape; gray-level images; intensity image; local disturbances; optical 3D sensors; production line; recognition accuracy; solder joints; supplementary processing; surface coordinates; surface properties; surface-mounting technologies; through-hole mounting; wave-soldered components; Automatic optical inspection; Geometrical optics; Image sensors; Integrated circuit technology; Optical devices; Optical sensors; Optical surface waves; Printed circuits; Soldering; Surface waves;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 1990. IECON '90., 16th Annual Conference of IEEE

Conference_Location

Pacific Grove, CA

Print_ISBN

0-87942-600-4

Type

conf

DOI

10.1109/IECON.1990.149240

Filename

149240