• DocumentCode
    1641073
  • Title

    Coupled-field analysis of a new hybrid electromagnetic coil launcher

  • Author

    Xuehui Chen ; Min Wang ; Jie Wu ; Zhao Wang

  • Author_Institution
    Naval Aeronaut. & Astronaut. Univ., Yantai, China
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Electromagnetic coil launcher (EMCL) is a special launch device which utilizes coaxial arrangement helix coils (HC) to generate electromagnetic forces acting on the armature. A new hybrid electromagnetic coil launcher (NHEMCL) is designed in this paper, in which a pancake coil (PC) is added to the bottom of barrel, and a disk armature is added to the tail of the sleeve armature. Such the armature is pushed by two drive-coils in the first stage at the same time, and greater force is produced. The structure composition and working principle of the launcher are introduced. Composite of two drive-coils in the first stage, the field-circuit coupling analysis of NHEMCL is set up. The current of drive-coils, the accelerative force and speed of the armature are obtained through simulation. In order to analyze the structure intensity of the NHEMCL, 3-D finite element model is built, and the magnetic-structure coupling analysis is made. The stress and strain in drive-coils are obtained. The results show that greater forces produced in the first stage.
  • Keywords
    coils; electromagnetic launchers; finite element analysis; 3D finite element model; coaxial arrangement helix coils; coupled-field analysis; disk armature; drive-coils; electromagnetic forces; field-circuit coupling analysis; hybrid electromagnetic coil launcher; magnetic-structure coupling analysis; pancake coil; sleeve armature; special launch device; structure intensity; Acceleration; Coils; Couplings; Force; Magnetomechanical effects; Mathematical model; Stress; EMCL; Field-Circuit Coupling; Helix Coil; Magnetic-Structure Coupling; Pancake Coil;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Launch Technology (EML), 2012 16th International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4673-0306-4
  • Type

    conf

  • DOI
    10.1109/EML.2012.6325151
  • Filename
    6325151