• DocumentCode
    1641108
  • Title

    Analytical models of the transition layer in HEMTs on silicon substrate for device simulation

  • Author

    Andrei, Petru

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida State Univ., Tallahassee, FL, USA
  • fYear
    2010
  • Firstpage
    1931
  • Lastpage
    1933
  • Abstract
    One way to increase the breakdown voltage in heterojunction field-effect-transistors (HFETs) on silicon substrate is to introduce a transition (buffer) layer made of a sandwich of thin AlN/AlGaN layers between the silicon substrate and the GaN well. The effect of this transition layer is to average out and, in this way, to reduce the local mechanical stress that appears between the silicon substrate and the GaN layer because of the different lattice constants of the two layers. In this article we present an analytical model for the simulation of the transition layer in AlN/AlGaN transistors. The model is based on writing explicitly the interface conditions at each boundary and solving the resulting system of equations analytically. The final equation is written in the form of a standard mixed-type boundary condition that can be relatively easy implemented in device simulators.
  • Keywords
    III-V semiconductors; aluminium compounds; electric breakdown; high electron mobility transistors; semiconductor device models; silicon; substrates; AlN-AlGaN; HEMT; HFET; breakdown voltage; device simulation; heterojunction field-effect-transistors; silicon substrate; standard mixed-type boundary condition; transition layer; Analytical models; Boundary conditions; Equations; Gallium nitride; Mathematical model; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667795
  • Filename
    5667795