مرکز منطقه ای اطلاع رساني علوم و فناوري - Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

DocumentCode :

1641322

Title :

Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

fYear :

2004

Abstract :

Presents the title -page of the proceedings record.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on

Conference_Location :

Shanghai, China

Print_ISBN :

0-7803-8620-5

Type :

conf

DOI :

10.1109/HPD.2004.1346657

Filename :

1346657

Link To Document :