مرکز منطقه ای اطلاع رساني علوم و فناوري - Welcome from the Chairs of the Conference

DocumentCode :

1641336

Title :

Welcome from the Chairs of the Conference

fYear :

2004

Abstract :

Presents the welcome message from the conference proceedings.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on

Conference_Location :

Shanghai, China

Print_ISBN :

0-7803-8620-5

Type :

conf

DOI :

10.1109/HPD.2004.1346659

Filename :

1346659

Link To Document :