DocumentCode :
1641511
Title :
Recent progress toward anisotropic conductive films in flat panel display and semiconductor packaging applications
Author :
Matsuda, Kazuya ; Watanabe, Itsuo
Author_Institution :
Adv. Interconnect Material Bus. Unit, Hitachi Chem. Co., Ltd., Ibaraki, Japan
fYear :
2004
Firstpage :
8
Lastpage :
13
Abstract :
Anisotropic conductive films (ACFs) consist of conducting particles and adhesive resins and have been widely used for packaging technologies in FPDs (flat panel displays) such as LCDs(liquid crystal displays) for last decades. So far various packaging technologies such as TCP(tape carrier package) on LCD panel or PWB(printed wiring board), COF(chip on flex) on LCD panel or PWB and COG(chip on glass) using ACFs have been realized to meet the requirement of fine pitch capability and make the flat panel displays smaller, lighter and thinner. In order to meet fine pitch capability smaller than 50 μm pitch, COF technologies has been introduced instead of TCP interconnection. The adhesion characteristics against COF have been improved by optimizing the elastic modulus of ACF and introducing the reaction group into the adhesive resin. It was demonstrated that the developed ACF shows low contact resistance even after exposed to a high temperature humidity test. It was also confirmed that making conducting particles smaller is advantageous for the driver IC with small bump size and space in COG. The warpage behavior of COG has been clarified by the elastic simulation analysis. In addition, it was demonstrated that heating a glass substrate appropriately during COG interconnection and the use of a low stress type of ACF are very effective in reducing the warpage and improving the connection reliability in COG interconnection.
Keywords :
adhesives; conducting polymers; elastic moduli; flat panel displays; integrated circuit interconnections; integrated circuit reliability; liquid crystal displays; packaging; printed circuits; resins; semiconductor thin films; COG interconnection; LCD panel; TCP interconnection; adhesion characteristics; adhesive resins; anisotropic conductive films; chip on flex; chip on glass; conducting particles; connection reliability; contact resistance; driver IC; elastic modulus optimization; elastic simulation analysis; fine pitch capability; flat panel display; glass substrate; high temperature humidity test; liquid crystal displays; low stress type ACF; printed wiring board; reaction group; semiconductor packaging; tape carrier package; warpage behavior; warpage reduction; Adhesives; Anisotropic conductive films; Contact resistance; Flat panel displays; Glass; Liquid crystal displays; Resins; Semiconductor device packaging; Temperature; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
Type :
conf
DOI :
10.1109/HPD.2004.1346663
Filename :
1346663
Link To Document :
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