Title :
3D modelling of a thermopile-based SOI CMOS thermal wall shear stress sensor
Author :
Falco, C. ; De Luca, A. ; Sarfraz, Sohab ; Haneef, I. ; Coull, J. ; Ali, Syed Zishan ; Udrea, F.
Author_Institution :
Dept. of Eng., Univ. of Cambridge, Cambridge, UK
Abstract :
This paper presents a multiphysic 3-D model of an SOI CMOS MEMS thermal wall shear stress sensor obtained using “Comsol Multiphysics”. It includes all the physical domains involved and their interaction. After a brief introduction, the device is presented and its working principle explained. The numerical model and the validation process are then described.
Keywords :
CMOS integrated circuits; integrated circuit modelling; microsensors; numerical analysis; stress measurement; temperature sensors; thermopiles; Comsol Multiphysics; multiphysic 3D model; numerical model; thermopile-based SOI CMOS MEMS thermal wall shear stress sensor; Decision support systems; Heating; Microassembly; Numerical models; Sensors; Standards; Stress;
Conference_Titel :
Semiconductor Conference (CAS), 2014 International
Conference_Location :
Sinaia
Print_ISBN :
978-1-4799-3916-9
DOI :
10.1109/SMICND.2014.6966459
