Title :
The effects of laser reflow conditions on the formation of intermetallic compounds at Sn3.0Ag0.5Cu solder/Cu joint interface
Author :
Liu, Wei ; Wang, Chunqing ; Li, Mingyu ; Tian, Yanhong ; Guan, Jingwei
Author_Institution :
Nat. Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China
Abstract :
This paper presents intermetallic compounds formation at the interface between the Sn3.0Ag0.5Cu solder and Cu pad during a first laser reflow, and then followed by a second hot air reflow processes. Cu3Sn was observed at the laser reflow solder joints, and its morphology was strongly dependent on the laser reflow power and heating time applied .The compound was formed in the first laser reflow process also changed after the secondary hot air reflow process. Cu6Sn5 was formed in the joint after the secondary hot air reflow process, and it was found that the morphology of intermetallic compound formed by the second hot air reflow were also affected by the conditions of the first laser reflow.
Keywords :
chemical interdiffusion; interface structure; reflow soldering; solders; surface morphology; tin compounds; Sn3.0Ag0.5Cu solder; SnAgCu-Cu; heating time; hot air reflow processes; intermetallic compounds formation; joint interface; laser reflow conditions; laser reflow power; laser reflow solder joints; Copper; Heating; Intermetallic; Laser transitions; Lead; Morphology; Power lasers; Reflow soldering; Scanning electron microscopy; Temperature;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346676
