Title :
A distributed electro-thermal model of AlGaN/GaN HEMT power-bar derived from the elementary cell model
Author :
Xiong, Anbin ; Gatard, E. ; Charbonniaud, C. ; Faqir, M. ; Kuball, M. ; Buchta, M. ; Rochette, Stephane ; Favede, L. ; Ouarch, Z. ; Floriot, D.
Author_Institution :
AMCAD Eng., Limoges, France
Abstract :
This paper deals with the development of a 120W AlGaN/GaN power bar model starting from the modeling of the elementary cell of the device. The approach consists in coupling a distributed thermal model of the power bar to each electro-thermal model of the elementary cells which constitute the power bar. The distributed nature of the temperature is taken into account by mean of a thermal RC network generated from the 3D Finite Element (FE) simulations. These thermal simulations take into account of the non linearity of the thermal conductivity with the temperature and the thermal coupling between the cells. The studied power bar is made of fifteen elementary cells juxtaposed, i.e. 15×(6×400μm) AlGaN/GaN HEMT devices. First, a full on wafer characterizations campaign, i.e. pulsed I(V) with pulsed S parameters and load-pull measurements, has been led on the elementary cell devices in order to extract and validate the unitary cell model 6×400μm. Then, preliminary stability tests and S parameters have been performed in order to validate the ability to safely measure the power bar mounted on the dedicated test vehicle. Load-pull measurements were then performed on the power bar and compared to the simulations given by the developed power bar model. Finally, a last comparison between the simulation of the High Power Amplifier (HPA) design and its breadboard measurement in L band fully validated the power bar model and the practical methodology used.
Keywords :
III-V semiconductors; S-parameters; aluminium compounds; finite element analysis; gallium compounds; power HEMT; semiconductor device models; thermal conductivity; wide band gap semiconductors; 3D finite element simulation; AlGaN-GaN; FE simulations; HEMT power-bar model; HPA design; L band; breadboard measurement; distributed electro-thermal model; elementary cell devices; elementary cell model; high power amplifier design; load-pull measurements; power 120 W; pulsed S-parameters; stability tests; thermal RC network; thermal conductivity; thermal coupling; thermal simulations; unitary cell model; Finite element analysis; Integrated circuit modeling; Load modeling; Power measurement; Semiconductor device modeling; Solid modeling; Transistors; AlGaN/GaN power bar; Electro thermal model; distributed thermal model; high power amplifier;
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European
Conference_Location :
Amsterdam
Print_ISBN :
978-1-4673-2302-4
Electronic_ISBN :
978-2-87487-026-2