Title :
Method for selecting semiconductor process equipment using empowered teams
Author_Institution :
Digital Equipment Corp., Hudson, MA, USA
Abstract :
A method is described for enabling self-managed teams of engineers to choose semiconductor process equipment for use in a new sub-half micron, 8" wafer fabrication facility. The selected equipment was required to meet the needs of process development and manufacturing. Process capability, manufacturability, impact on fab start up schedule, supplier support, capital cost, cost of ownership, and risk management issues were considered by the teams during the selection process
Keywords :
integrated circuit manufacture; 8 in; capital cost; cost of ownership; empowered teams; fab start up schedule; manufacturability; process capability; process development; risk management issues; self-managed teams; semiconductor process equipment; supplier support; wafer fabrication facility; Contingency management; Costs; Etching; Fabrication; Financial management; Job shop scheduling; Manufacturing processes; Process planning; Risk management; Semiconductor device manufacture;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-2053-0
DOI :
10.1109/ASMC.1994.588193
