DocumentCode :
1642078
Title :
Buckle-driven delamination of thin film and the influence of the Casimir or van der Waals force interaction
Author :
Shouwen, Yu ; Qunyang, Li
Author_Institution :
Dept. of Eng. Mech., Tsinghua Univ., Beijing, China
fYear :
2004
Firstpage :
128
Lastpage :
133
Abstract :
Indentation test is becoming increasingly used to quantitatively assess the thin film interfacial adhesion for its simplicity and ability to mechanically probe the smallest of solids. The conventional technique is based on the analysis of a combination of linear elastic fracture mechanics (LEFM) and simplified post-buckling theory. In this paper a full post-buckling response of thin film is investigated by FEM calculation; the contributions of double-buckling to the indentation test is discussed. The results show that double-buckling needs more energy than single-buckling case thus lead to a greater value of strain energy release rate. Finally, the influences of the Casimir or van der Waals interaction on the post-buckling behavior between the thin film and substrate are considered.
Keywords :
buckling; delamination; finite element analysis; semiconductor thin films; van der Waals forces; Casimir force interaction; FEM calculation; buckle-driven delamination; double-buckling response; indentation test; linear elastic fracture mechanics; post-buckling behavior; post-buckling response; post-buckling theory; strain energy release rate; thin film delamination; thin film interfacial adhesion; van der Waals force interaction; Adhesives; Capacitive sensors; Casimir effect; Delamination; Lead; Probes; Solids; Substrates; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
Type :
conf
DOI :
10.1109/HPD.2004.1346685
Filename :
1346685
Link To Document :
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