• DocumentCode
    1642078
  • Title

    Buckle-driven delamination of thin film and the influence of the Casimir or van der Waals force interaction

  • Author

    Shouwen, Yu ; Qunyang, Li

  • Author_Institution
    Dept. of Eng. Mech., Tsinghua Univ., Beijing, China
  • fYear
    2004
  • Firstpage
    128
  • Lastpage
    133
  • Abstract
    Indentation test is becoming increasingly used to quantitatively assess the thin film interfacial adhesion for its simplicity and ability to mechanically probe the smallest of solids. The conventional technique is based on the analysis of a combination of linear elastic fracture mechanics (LEFM) and simplified post-buckling theory. In this paper a full post-buckling response of thin film is investigated by FEM calculation; the contributions of double-buckling to the indentation test is discussed. The results show that double-buckling needs more energy than single-buckling case thus lead to a greater value of strain energy release rate. Finally, the influences of the Casimir or van der Waals interaction on the post-buckling behavior between the thin film and substrate are considered.
  • Keywords
    buckling; delamination; finite element analysis; semiconductor thin films; van der Waals forces; Casimir force interaction; FEM calculation; buckle-driven delamination; double-buckling response; indentation test; linear elastic fracture mechanics; post-buckling behavior; post-buckling response; post-buckling theory; strain energy release rate; thin film delamination; thin film interfacial adhesion; van der Waals force interaction; Adhesives; Capacitive sensors; Casimir effect; Delamination; Lead; Probes; Solids; Substrates; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
  • Print_ISBN
    0-7803-8620-5
  • Type

    conf

  • DOI
    10.1109/HPD.2004.1346685
  • Filename
    1346685