Title :
Image analysis and data processing of time series fringe pattern of PCBs by using moire interferometry
Author :
Han, Lei ; Zhong, Jue ; Voloshin, Arkady
Author_Institution :
Central South Univ., Changsha, China
Abstract :
This paper discusses the image analysis and data processing for thermal deformation measurement of PCBs. A specially designed test bench was employed successfully to measure the deformation of PCB using moire interferometry. The discussions on optical methods, experimental procedure and image data processing is presented. Fourier-based and wavelet-based approaches are discussed for potential automatic processing. All image and data analysis were finished by MATLAB.
Keywords :
deformation; discrete Fourier transforms; image processing; light interferometry; moire fringes; printed circuits; thermal stresses; wavelet transforms; Fourier-based approach; MATLAB; PCBs; data analysis; experimental procedure; image analysis; image data processing; moire interferometry; optical methods; potential automatic processing; test bench; thermal deformation measurement; time series fringe pattern; wavelet-based approach; Cameras; Data processing; Gratings; Image analysis; Interference; Microelectronics; Optical interferometry; Optical recording; Optical sensors; Thermal stresses;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346687
