DocumentCode
1642279
Title
Design of buried hinge based 3D torsional micro mirrors
Author
Zairi, Sofiane ; Tian, Gui Yun
Author_Institution
Sch. of Comput. & Eng., Huddersfield Univ., UK
fYear
2004
Firstpage
164
Lastpage
170
Abstract
In recent years, substantial research has been carried out on 3D micro mirrors. Torsional micromirror is among the most interesting. After reviewing the recent development of torsional micro mirrors, this paper presents and studies a new design approach of 3D OXC torsional micro-mirrors. These devices are made by using CMP polishing method, wich offers a good surface flatness and don´t suffer from the bottom layers conformality, encountered with the RIE etching used in some conventional surface micro-machining processes. The design is optimised by using FEM analysis method. The simulation results have contributed to the success of the tested MOEMS components. These micro mirrors provide larger integration density, enhanced flatness, larger deflection angle and lower driving voltage than current MEMS design.
Keywords
chemical mechanical polishing; etching; finite element analysis; micromirrors; optimisation; 3D OXC torsional micro-mirrors; CMP polishing; FEM analysis; MEMS design; MOEMS components; RIE etching; bottom layer conformality; buried hinge; deflection angle; driving voltage; integration density; micro mirror design; micro-machining; surface flatness; Fabrics; Fasteners; Liquid crystal displays; Liquid crystals; Micromechanical devices; Mirrors; Optical devices; Optical losses; Scalability; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN
0-7803-8620-5
Type
conf
DOI
10.1109/HPD.2004.1346692
Filename
1346692
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