Title :
Electrostatic field analysis of surface acoustic wave devices: A three-dimensional representation
Author :
Zidek, H.P. ; Baghai-Wadji, A.R.
Author_Institution :
Tech. Univ., Wien, Austria
Abstract :
For previous paper see ibid vol.1, p.154-7 (1991). The authors´ previous method is extended by the inclusion of a larger class of boundary value problems, which result in a more realistic model of microelectronic devices. The effect of finite thickness of the electrodes as well as the influence of the metallic package are considered. An error analysis and a selection of numerical calculations are presented
Keywords :
boundary-value problems; electric fields; error analysis; numerical methods; surface acoustic wave devices; 3D analysis; boundary value problems; electrode finite thickness; electrostatic field analysis; error analysis; metallic package influence; microelectronic devices; numerical calculations; surface acoustic wave devices; three-dimensional representation; Acoustic waves; Anisotropic magnetoresistance; Boundary value problems; Electrodes; Electrostatic analysis; Green´s function methods; Maxwell equations; Packaging; Solid modeling; Surface acoustic wave devices;
Conference_Titel :
Electrotechnical Conference, 1991. Proceedings., 6th Mediterranean
Conference_Location :
LJubljana
Print_ISBN :
0-87942-655-1
DOI :
10.1109/MELCON.1991.161803
