A low cost bumping method for flip chip assembly and MEMS integration

Author

Zhang, J.H. ; Wang, C.H. ; Pang, A.J. ; Zeng, J.

Author_Institution

Sch. of Mechatronics Eng. & Autom., Shanghai Univ., China

fYear

2004

Firstpage

171

Lastpage

176

Abstract

In this paper we present the development of a low cost chip/wafer bumping technique for flip chip assembly and MEMS integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel and gold bumps are fabricated on a low cost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallised with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Bump shear test was conducted and showed that good bonding strength was achieved between the bumps and the pads.

Keywords

flip-chip devices; metallisation; micromechanical devices; wafer bonding; Al; Au; Cu; MEMS integration; Ni; aluminum pads; bump fabrication; bump shear test; bump transfer approach; chip-wafer bumping; copper bumps; electroless nickel; flip chip assembly; gold bumps; high melting temperature bumps; low cost bumping; nickel bumps; parallel bonding; remetallisation; target board; test chips; thermocompression bonding; Assembly; Closed loop systems; Costs; Flip chip; Gold; Micromechanical devices; Nickel; Temperature; Testing; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on

Print_ISBN

0-7803-8620-5

Type

conf

DOI

10.1109/HPD.2004.1346693

Filename

1346693