Title :
Analysis & solution for the white-residue after soldering
Author :
Liu, Zhe ; Li, Guang Yu ; Jia, Zhongzhong ; Song, Haoqiang
Author_Institution :
Shen Zen ZTE Co. Ltd., Guangdong, China
Abstract :
This article is mainly aimed at the white residue emerged after soldering, expatriate the reason why this happened and analyze character of the residue so as to find solution to solve this problem.
Keywords :
soldering; residue character analysis; soldering; white residue; Cleaning; Environmentally friendly manufacturing techniques; Industrial pollution; Petroleum; Pollution measurement; Soldering; Temperature; Testing; Waste handling; Wire;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346697
