Title :
Technology development and basic theory study of fluid dispensing - a review
Author :
Jianping, Li ; Guiling, Deng
Author_Institution :
Coll. of Mech. & Electr. Eng., Central South Univ., HuNan, China
Abstract :
Fluid dispensing is widely applied in chip package and circuit assembly. This paper reviews the advantage and limits of four kinds fluid dispensing technology, which are time-pressure dispensing, auger pump dispensing, piston valve dispensing, and jetting dispensing, and their existing status in both technology development and research, analyzes the challenge of advanced and high throughput packaging to fluid dispensing technology, discusses briefly basic theory study subject of fluid dispensing for next generation package technology.
Keywords :
fluids; packaging; auger pump dispensing; chip package; circuit assembly; fluid dispensing; jetting dispensing; packaging; piston valve dispensing; technology development; time-pressure dispensing; Assembly; Chip scale packaging; Circuits; Electronics packaging; Flip chip; Pistons; Pumps; Semiconductor device packaging; Surface-mount technology; Throughput;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346698
