• DocumentCode
    1642402
  • Title

    Technology development and basic theory study of fluid dispensing - a review

  • Author

    Jianping, Li ; Guiling, Deng

  • Author_Institution
    Coll. of Mech. & Electr. Eng., Central South Univ., HuNan, China
  • fYear
    2004
  • Firstpage
    198
  • Lastpage
    205
  • Abstract
    Fluid dispensing is widely applied in chip package and circuit assembly. This paper reviews the advantage and limits of four kinds fluid dispensing technology, which are time-pressure dispensing, auger pump dispensing, piston valve dispensing, and jetting dispensing, and their existing status in both technology development and research, analyzes the challenge of advanced and high throughput packaging to fluid dispensing technology, discusses briefly basic theory study subject of fluid dispensing for next generation package technology.
  • Keywords
    fluids; packaging; auger pump dispensing; chip package; circuit assembly; fluid dispensing; jetting dispensing; packaging; piston valve dispensing; technology development; time-pressure dispensing; Assembly; Chip scale packaging; Circuits; Electronics packaging; Flip chip; Pistons; Pumps; Semiconductor device packaging; Surface-mount technology; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
  • Print_ISBN
    0-7803-8620-5
  • Type

    conf

  • DOI
    10.1109/HPD.2004.1346698
  • Filename
    1346698