DocumentCode
1642402
Title
Technology development and basic theory study of fluid dispensing - a review
Author
Jianping, Li ; Guiling, Deng
Author_Institution
Coll. of Mech. & Electr. Eng., Central South Univ., HuNan, China
fYear
2004
Firstpage
198
Lastpage
205
Abstract
Fluid dispensing is widely applied in chip package and circuit assembly. This paper reviews the advantage and limits of four kinds fluid dispensing technology, which are time-pressure dispensing, auger pump dispensing, piston valve dispensing, and jetting dispensing, and their existing status in both technology development and research, analyzes the challenge of advanced and high throughput packaging to fluid dispensing technology, discusses briefly basic theory study subject of fluid dispensing for next generation package technology.
Keywords
fluids; packaging; auger pump dispensing; chip package; circuit assembly; fluid dispensing; jetting dispensing; packaging; piston valve dispensing; technology development; time-pressure dispensing; Assembly; Chip scale packaging; Circuits; Electronics packaging; Flip chip; Pistons; Pumps; Semiconductor device packaging; Surface-mount technology; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN
0-7803-8620-5
Type
conf
DOI
10.1109/HPD.2004.1346698
Filename
1346698
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