DocumentCode
1642435
Title
An experimental system for the mechanism research of contact fluid dispensing dot
Author
Guiling, Deng ; JingHua, Xie ; Zhong Jue
Author_Institution
Coll. of Mech. & Electr. Eng., Central South Univ., Hunan, China
fYear
2004
Firstpage
206
Lastpage
212
Abstract
The physical mechanism of contact fluid dispensing is very complicated and controlling of contact fluid dispensing process is a known difficult problem in microelectronic packaging. But there has been little mechanism research on contact fluid dispensing and nearly all control methods of dispensing process are basically based on black box model. This paper puts forward an idea of phasing study fluid dynamic evolvement mechanism in contact fluid dispensing dot and farther dividing the fluid dynamic evolvement process into four different phase from the view of fluid dynamics. Directed by the idea of phasing study and by adopting the high speed imaging system as main study means, an experimental system for the research of the fluid dynamic evolvement mechanism of contact dispensing dot is being developed. The experimental system consists of mainly mechanical system, control and measurement system, high-speed imaging system and pneumatic system, and it has a lot of features that are specially designed for fulfilling the requirement of the phasing study method. The experimental research of the fluid dynamic evolvement of fluid contact dispensing dot process will let us acquire new knowledge about the fluid dynamics mechanism of contact dispensing dot, which is lack at present, understand about more parameters´ influences on the dispensing process, and make process control models be more accurate and less black box.
Keywords
fluid dynamics; black box model; contact fluid dispensing dot; control system; fluid dynamic evolvement; fluid dynamics; high speed imaging system; measurement system; mechanical system; microelectronic packaging; phasing study; pneumatic system; Assembly; Circuits; Contacts; Flip chip; Fluid dynamics; Microelectronics; Needles; Packaging; Process control; US Department of Transportation;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN
0-7803-8620-5
Type
conf
DOI
10.1109/HPD.2004.1346699
Filename
1346699
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