DocumentCode :
1642435
Title :
An experimental system for the mechanism research of contact fluid dispensing dot
Author :
Guiling, Deng ; JingHua, Xie ; Zhong Jue
Author_Institution :
Coll. of Mech. & Electr. Eng., Central South Univ., Hunan, China
fYear :
2004
Firstpage :
206
Lastpage :
212
Abstract :
The physical mechanism of contact fluid dispensing is very complicated and controlling of contact fluid dispensing process is a known difficult problem in microelectronic packaging. But there has been little mechanism research on contact fluid dispensing and nearly all control methods of dispensing process are basically based on black box model. This paper puts forward an idea of phasing study fluid dynamic evolvement mechanism in contact fluid dispensing dot and farther dividing the fluid dynamic evolvement process into four different phase from the view of fluid dynamics. Directed by the idea of phasing study and by adopting the high speed imaging system as main study means, an experimental system for the research of the fluid dynamic evolvement mechanism of contact dispensing dot is being developed. The experimental system consists of mainly mechanical system, control and measurement system, high-speed imaging system and pneumatic system, and it has a lot of features that are specially designed for fulfilling the requirement of the phasing study method. The experimental research of the fluid dynamic evolvement of fluid contact dispensing dot process will let us acquire new knowledge about the fluid dynamics mechanism of contact dispensing dot, which is lack at present, understand about more parameters´ influences on the dispensing process, and make process control models be more accurate and less black box.
Keywords :
fluid dynamics; black box model; contact fluid dispensing dot; control system; fluid dynamic evolvement; fluid dynamics; high speed imaging system; measurement system; mechanical system; microelectronic packaging; phasing study; pneumatic system; Assembly; Circuits; Contacts; Flip chip; Fluid dynamics; Microelectronics; Needles; Packaging; Process control; US Department of Transportation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
Type :
conf
DOI :
10.1109/HPD.2004.1346699
Filename :
1346699
Link To Document :
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