Title :
Computer-based data acquisition for wire bonding studies
Author :
Fu-liang, Wang ; Lei, Han ; Jue, Zhong
Author_Institution :
Coll. of Mech. & Electronical Eng., Central South Univ., Changsha, China
Abstract :
Ultrasonic bonding is the most commonly used interconnect technology in microelectronics manufacturing. This paper presents a data acquisition solution that enables reliable transfer of the data from digital storage oscilloscope to PC. Realizations of RS232 serial communications are discussed and accomplished. The measurement shows that the system works well for further processing in bonding studies.
Keywords :
circuit CAD; data acquisition; digital storage oscilloscopes; integrated circuit bonding; integrated circuit interconnections; transducers; RS232 serial communications; computer-based data acquisition; data transfer; digital storage oscilloscope; interconnect technology; microelectronics manufacturing; transducer; ultrasonic bonding; wire bonding studies; Bonding processes; Communication standards; Data acquisition; Flowcharts; Oscilloscopes; Ultrasonic transducers; Ultrasonic variables measurement; Vibrations; Voltage; Wire;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346703
