Packaging effects on the performances of MEMS for high-G accelerometer: frequency-domain and time-domain analyses

In this work, the finite element simulations have been applied in frequency-domain and time-domain analyses for a packaged MEMS accelerometer used in high-G environments. The results from simulations of packaging effects on the performances of MEMS for high-G accelerometer show that the Young´s moduli of seal adhesive has important influences on the mode shapes of the packaged accelerometer and a small Young´s modulus will bring in strong distortion of output signal of accelerometer. As the Young´s moduli increased, the waveform of accelerometer output signal became better after digital filtering. The seal adhesive with Young´s modulus like molding compound in IC packaging would not induce significant problems in signal distortion. The frequency and averaged amplitude of output signal of the packaged accelerometer were not affected by Young´s modulus of seal material. The accelerometer output was linearly dependent on the input of acceleration impulse and the response was very well when the input of the acceleration amplitudes changed.