DocumentCode :
1642907
Title :
The characteristics of ultrasonic vibration transmission and coupling in bonding technology
Author :
Junhui, Li ; Jianping, Tan ; Lei, Han ; Jue, Zhong
Author_Institution :
Mech.-Electron. Eng. Coll., Central South Univ., Hunan, China
fYear :
2004
Firstpage :
311
Lastpage :
315
Abstract :
Ultrasonic vibration transmission is a very critical and complex problem in bonding equipment. In this paper, the transmitting model of ultrasonic vibration in ultrasonic transducer and capillary have been given out by utilizing the propagating mechanism of ultrasonic wave in elastic body. The ultrasonic vibration displacement and velocity of high frequency were measured by using the laser doppler vibrometer PSV-400-M2(1.5MHz), then the conclusion in theory have been proven. Ultrasonic vibration displacement (or velocity) and energy density increase with decreasing section in the transmitting process. The coupling characteristics of ultrasonic longitudinal-complex transverse vibration system are simulated by Matlab software. Vibration locus shapes driven simultaneously by the same frequency and different frequencies are elliptical (or circular) loci and rectangular (or square) loci respectively. Microstructure characteristics at bonding interface were observed by using scanning electron microscope (KYKY2800), and would be improved by coupling loci, thus bond strength and quality would be enhanced. An advanced bond pattern would be indicated. And we draw some conclusions that have important theoretical and practical significance for further research about thermosonic bond technology.
Keywords :
integrated circuit bonding; scanning electron microscopes; ultrasonic bonding; ultrasonic transducers; ultrasonic velocity; vibrations; Matlab software; bond pattern; bond strength; bonding equipment; bonding interface; bonding technology coupling; coupling characteristics; coupling loci; elastic body; elliptical loci; laser doppler vibrometer; microstructure characteristics; propagating mechanism; rectangular loci; scanning electron microscope; thermosonic bond technology; ultrasonic longitudinal-complex transverse vibration system; ultrasonic transducer; ultrasonic vibration displacement; ultrasonic vibration transmission; ultrasonic wave; vibration locus shapes; Bonding; Couplings; Displacement measurement; Frequency measurement; Mathematical model; Optical propagation; Ultrasonic transducers; Ultrasonic variables measurement; Velocity measurement; Vibration measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
Type :
conf
DOI :
10.1109/HPD.2004.1346718
Filename :
1346718
Link To Document :
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