Title :
Wafer-level technology for sub-mm wave focal plane arrays
Author :
Mehdi, Imran ; Chattopadhyay, Goutam ; Choonsup Lee ; Reck, Theodore ; Jung, Cheolkon ; Siles, Jose ; Cooper, Ken ; Llombart, Nuria
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
A robust and compact scheme for building Submm-wave array receivers will be presented in this paper. By utilizing wafer-level integration the scheme enables compact multi-pixel modules. Bulk Silicon Deep Reactive Ion Etching techniques are used to build waveguides that allow the RF signals to be routed in the third dimension. Finally, a novel micro-lens antenna has been designed; fabricated and characterized that allows the antenna array to be fabricated via standard photolithography thus making it possible to build a beam-forming array. Preliminary work has focused on demonstrating a single pixel 500-600 GHz receiver front end and the characterization of the micro-lens.
Keywords :
antenna arrays; array signal processing; elemental semiconductors; focal planes; lens antennas; microlenses; photolithography; silicon; sputter etching; submillimetre wave antennas; submillimetre wave receivers; waveguides; RF signals; Si; antenna array; beam-forming array; bulk silicon deep reactive ion etching techniques; compact multipixel modules; microlens antenna; microlens characterization; single pixel receiver front end; standard photolithography; submillimeter wave focal plane arrays; submm-wave array receivers; wafer-level integration; wafer-level technology; Antenna arrays; Buildings; Imaging; Lenses; Receivers; Schottky diodes; Silicon; Focal plane arrays; Schottky diodes; receiver front ends; submillimeter imaging arrays;
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2012 7th European
Conference_Location :
Amsterdam
Print_ISBN :
978-1-4673-2302-4
Electronic_ISBN :
978-2-87487-026-2
