Title :
The improvement on the properties of silver-containing conductive adhesives by the addition of carbon nanotube
Author :
Xuechun, Lin ; Feng, Lin
Author_Institution :
Shenzhen Polytech., Guangdong, China
Abstract :
A sprinkle multiwall-carbon nanotubes, adding into the system of epoxy resin (EP), can bring the resin system to semiconducting state. Adding such kind of carbon nanotubes in the Ag/EP system which the content of conducting particle is below the threshold, can ameliorate its conducting capacity. 0.4wt.% of carbon nanotubes in the 57wt%Ag/EP system, the bulk resistivity reduced from 106Ω.cm to 10-2Q.cm reduced 8 quantity steps.
Keywords :
adhesives; carbon nanotubes; polymers; Ag/EP system; bulk resistivity; conducting capacity; conducting particle; epoxy resin; multiwall-carbon nanotubes; resin system; semiconducting state; Additives; Carbon nanotubes; Conductive adhesives; Conductivity; Electric resistance; Epoxy resins; Glass; Powders; Silver; Testing;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346734
