• DocumentCode
    1643376
  • Title

    Recessed gate AlGaN/GaN MODFET on sapphire grown by MOCVD

  • Author

    Egawa, T. ; Ishikawa, Hiroshi ; Jimbo, T. ; Umeno, Masayoshi

  • Author_Institution
    Res. Center for Micro-Structure Devices, Nagoya Inst. of Technol., Japan
  • fYear
    1999
  • Firstpage
    401
  • Lastpage
    404
  • Abstract
    A recessed gate AlGaN/GaN modulation-doped field-effect transistor (MODFET) has been grown on a sapphire substrate by metalorganic chemical vapor deposition (MOCVD). Two-dimensional electron gas (2DEG) mobility and sheet carrier density of AlGaN/GaN heterostructure on the sapphire substrate were 740 cm/sup 2//V/spl middot/s and 5.1/spl times/10/sup 12/ cm/sup -2/ at 300 K, and 12000 cm/sup 2//V/spl middot/s and 2.8/spl times/10/sup 12/ cm/sup -2/ at 8.9 K, respectively. The recessed gate device showed the maximum extrinsic transconductance 146 mS/mm and drain-source current 900 mA/mm for the AlGaN/GaN MODFET with a gate length Lg of 2.1 /spl mu/m at 25/spl deg/C. At an elevated temperature of 350/spl deg/C, the maximum extrinsic transconductance and drain-source current were 62 mS/mm and 347 mA/mm, respectively. The AlGaN/GaN MODFET exhibited the stable operation with good pinch-off characteristics at high temperatures, and the very weak temperature dependence of the threshold voltage. The drain current collapse was not observed in the dark and AC measurement.
  • Keywords
    III-V semiconductors; MOCVD coatings; aluminium compounds; carrier density; carrier mobility; gallium compounds; high electron mobility transistors; 350 C; Al/sub 2/O/sub 3/; AlGaN-GaN; MOCVD growth; drain-source current; extrinsic transconductance; pinch-off characteristics; recessed gate AlGaN/GaN MODFET; sapphire substrate; sheet carrier density; threshold voltage; two-dimensional electron gas mobility; Aluminum gallium nitride; Chemical vapor deposition; Epitaxial layers; FETs; Gallium nitride; HEMTs; MOCVD; MODFETs; Temperature dependence; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-5410-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1999.824179
  • Filename
    824179