Title :
Organic PGA packaging-a performance comparison with ceramic PGA
Author :
Viswanath, Ram ; Chia-Pin Chin
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
The current trend in the microprocessor industry is towards high performance devices, which poses challenges to package designers to deliver excellent package performance at reasonable costs. The development of a multi-layer plastic pin-grid array (PPGA) package as a reliable, cost effective replacement to ceramic PGA is presented. Package design aspects as well as choice of materials for enhanced performance are discussed. The primary focus is on the numerical modeling and characterization of thermal performance differences between ceramic and plastic PGA packaging. Differences in mechanical and electrical performance between plastic PGA and ceramic PGA packages are also highlighted in this paper
Keywords :
integrated circuit packaging; microprocessor chips; plastic packaging; electrical performance; mechanical performance; microprocessor; multilayer plastic pin-grid array; numerical model; organic PGA package; thermal performance; Ceramics; Contact resistance; Costs; Electronics packaging; Plastic packaging; Power dissipation; Surface resistance; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3793-X
DOI :
10.1109/STHERM.1997.566789
