DocumentCode :
1644578
Title :
A ring oscillator-based temperature sensor for U-healthcare in 0.13µ CMOS
Author :
Woo, Sung-Sik ; Lee, Jung-Hyup ; Cho, SeongHwan
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear :
2009
Firstpage :
548
Lastpage :
551
Abstract :
In this paper, a low-power ring oscillator-based temperature sensor designed for U-healthcare is presented. Unlike conventional temperature sensors relying on power-hungry bandgap references and ADCs, the proposed sensor exploits the frequency of the ring oscillator that increases as temperature increases as a way of converting temperature to a digital output. Power of the sensor is also saved by stacking circuits for charge recycling and carefully balancing top and bottom circuits to make every circuit operate within 0.3~0.5 V voltage headroom when 0.8 V supply voltage is used. The first order noise shaping is realized by the ring oscillator and the counter structure for higher resolution. Simulation results indicate that the proposed temperature sensor has a resolution of 0.18°C/LSB at 100 Hz of conversion rate over a temperature range of 5 to 100°C. The power consumption of the proposed temperature sensor is only 30 nW and the area is only 0.05 mm2 in a standard 0.13 ¿m CMOS process.
Keywords :
CMOS integrated circuits; analogue-digital conversion; biomedical electronics; body sensor networks; resonators; temperature sensors; ADCs; CMOS; U-healthcare; charge recycling; counter structure; digital output; first order noise shaping; frequency 100 Hz; power 30 nW; power-hungry bandgap references; ring oscillator; size 0.13 mum; stacking circuits; temperature 5 degC to 100 degC; temperature sensor; voltage 0.8 V; Circuit simulation; Counting circuits; Frequency conversion; Noise shaping; Photonic band gap; Recycling; Ring oscillators; Stacking; Temperature sensors; Voltage; charge recycling; noise shaping; ring oscillator; temperature sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SoC Design Conference (ISOCC), 2009 International
Conference_Location :
Busan
Print_ISBN :
978-1-4244-5034-3
Electronic_ISBN :
978-1-4244-5035-0
Type :
conf
DOI :
10.1109/SOCDC.2009.5423820
Filename :
5423820
Link To Document :
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