DocumentCode :
1644636
Title :
Characterization of longitudinal fin heat sink thermal performance and flow bypass effects through CFD methods
Author :
Barrett, Adam V. ; Obinelo, Izundu F.
Author_Institution :
Thermalloy Inc., Dallas, TX, USA
fYear :
1997
Firstpage :
158
Lastpage :
164
Abstract :
The thermal characteristics of straight-channel longitudinal fin heat sinks under forced air cooling is studied experimentally and numerically using computational fluid dynamics code. The aim of the study is to investigate the viability of employing commercially available CFD codes as effective and efficient means of gathering the vast amount of data required to adequately quantify heat sink characteristics in ducted flow. The parameters studied include the tip clearance and spanwise spacing across a range of approach flow rates and fin densities. These parameters were used to examine the influence of flow bypass phenomena on the thermal resistance and pressure drop across the heat sinks. Detailed results on the local and lump-parameter heat transfer and pressure drop characteristics are presented
Keywords :
channel flow; cooling; finite element analysis; heat sinks; integrated circuit packaging; thermal analysis; thermal resistance; CFD methods; computational fluid dynamics code; fin densities; flow bypass effects; flow rates; forced air cooling; longitudinal fin heat sink; lump-parameter heat transfer characteristics; pressure drop characteristics; spanwise spacing; straight-channel; thermal performance; thermal resistance; tip clearance; Computational fluid dynamics; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Testing; Thermal engineering; Thermal force; Thermal management; Trigeneration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX
ISSN :
1065-2221
Print_ISBN :
0-7803-3793-X
Type :
conf
DOI :
10.1109/STHERM.1997.566793
Filename :
566793
Link To Document :
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