Title :
50 nm gate-length CMOS transistor with super-halo: design, process, and reliability
Author :
Bin Yu ; Haihong Wang ; Milic, O. ; Qi Xiang ; Weizhong Wang ; An, J.X. ; Ming-Ren Lin
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Abstract :
CMOS transistors with a 50 nm physical gate length are demonstrated. Super-halo, implemented by angle-tilted implantation, is utilized to control V/sub th/ roll-off down to a gate length of 40 nm. Super-halo also provides V/sub th/ adjustment as well as a retrograde channel to suppress subsurface body punch-through. 935 /spl mu/A//spl mu/m and 395 /spl mu/A//spl mu/m on-state drive currents were achieved for n- and p-channel MOSFETs, respectively, with a V/sub dd/ of 1.5 V. The I/sub drive//(C/sub ox(inv)/V/sub dd/) figure-of-merit (FOM) of the CMOS devices falls on the trend line extrapolated from existing industrial CMOS technologies. The impacts of super-halo on V/sub th/ roll-off, DIBL, gate overlap Miller capacitance and junction capacitance in a 50 nm MOSFET are investigated. Strong halo can result in drain-to-halo (body) band-to-band tunneling leakage even at room temperature. Degradation of gate oxide leakage and hot-carrier reliability due to large-angle-tilted halo implant are concerns in 50 nm CMOS transistors.
Keywords :
CMOS integrated circuits; MOSFET; capacitance; hot carriers; ion implantation; leakage currents; semiconductor device reliability; tunnelling; 1.5 V; 50 nm; 50 nm physical gate length; CMOS transistors; DIBL; MOSFET; angle-tilted implantation; drain-to-halo band-to-band tunneling leakage; figure-of-merit; gate overlap Miller capacitance; gate oxide leakage degradation; hot-carrier reliability; junction capacitance; large-angle-tilted halo implant; nMOSFET; on-state drive currents; pMOSFET; retrograde channel; room temperature; subsurface body punch-through suppression; super-halo; threshold voltage roll-off control; CMOS process; CMOS technology; Capacitance; Degradation; Hot carriers; Implants; MOSFETs; Process design; Temperature; Tunneling;
Conference_Titel :
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-5410-9
DOI :
10.1109/IEDM.1999.824237