DocumentCode :
1644862
Title :
Polysilicon gate with depletion-or-metallic gate with buried channel: what evil worse ?
Author :
Josse, E. ; Skotnicki, T.
Author_Institution :
CNET, Grenoble, France
fYear :
1999
Firstpage :
661
Lastpage :
664
Abstract :
Metallic gates are expected to overcome polysilicon´s limitations, such as polydepletion. Nevertheless, this option must be associated with buried channel to ensure low V/sub TH/ operation. Taking into account realistic projections on technological capabilities, such as active gate doping, oxide thickness or junction depth, we confirm that the degradation in performances due to the buried channel is definitively much more restrictive than that relative to the polydepletion.
Keywords :
MOSFET; buried layers; semiconductor device metallisation; MOSFET; Si; active gate doping; buried channel; junction depth; metallic gate; oxide thickness; polysilicon gate depletion; Boron; Capacitance; Costs; Couplings; Data mining; Degradation; Doping; MOS devices; MOSFETs; Telecommunications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-5410-9
Type :
conf
DOI :
10.1109/IEDM.1999.824239
Filename :
824239
Link To Document :
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