Title :
Thermal characterization of chip packages-evolutionary development of compact models
Author :
Bar-Cohen, Avram ; Krueger, William B.
Author_Institution :
Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
Abstract :
The expanded-Rjc methodology, first proposed in 1989, makes it possible to extend the use of this common figure-of-merit to chip packages with non-isothermal cases. This proposal spurred considerable debate and contributed to renewed efforts to provide “compact” thermal models of single chip packages, for preliminary design, as well as for detailed numerical simulation of populated printed circuit boards. This work offers a review of the development of this modified-Rjc methodology and its efficacy in replicating the chip, or junction temperature predicted by detailed numerical simulation
Keywords :
finite element analysis; integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal resistance; chip packages; compact thermal models; expanded-Rjc methodology; figure-of-merit; junction temperature; nonisothermal cases; numerical simulation; thermal characterization; Electronic packaging thermal management; Numerical simulation; Power dissipation; Printed circuits; Proposals; Resistance heating; Surface resistance; Temperature; Thermal engineering; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3793-X
DOI :
10.1109/STHERM.1997.566796
