Modeling and Characteristic of the Vertical Bonding-Wire Interconnection in Ka-band

This paper announced a new type of bonding interconnect-vertical bonding interconnect. Bonding interconnect is the critical technique for realizing the interconnection of microwave chip. The height, distance, number of wires and joint space of bonding interconnect have important effects on its microwave characteristics. In this paper, commercial 3D electromagnetic analysis software HFSS , microwave circuit design software ADS and Agilent vector network analyzer were used to model, simulate and optimize for the microwave characteristics of bonding interconnect, and produce the model, experimental results shown in this paper.