DocumentCode :
164633
Title :
[Front cover]
fYear :
2014
fDate :
23-26 Oct. 2014
Abstract :
Presents the front cover of the proceedings record.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/SIITME.2014.6966981
Filename :
6966981
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=164633
