DocumentCode
164633
Title
[Front cover]
fYear
2014
fDate
23-26 Oct. 2014
Abstract
Presents the front cover of the proceedings record.
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location
Bucharest
Type
conf
DOI
10.1109/SIITME.2014.6966981
Filename
6966981
Link To Document