Title :
Table of contents
Abstract :
The following topics are dealt with: emerging technologies and trends in advanced packaging; power electronics and microsystems packaging; assembly and manufacturing technology; electronic circuit design; electronics simulation and modelling; electronics applications; optoelectronics and advanced communication packaging; and reliability.
Keywords :
circuit simulation; electronics packaging; integrated optoelectronics; micromechanical devices; network synthesis; power electronics; reliability; advanced communication packaging; assembly; electronic circuit design; electronics applications; electronics modelling; electronics packaging; electronics simulation; manufacturing technology; microsystems packaging; optoelectronics; power electronics; reliability;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location :
Bucharest
DOI :
10.1109/SIITME.2014.6966983
