A fast and accurate computation of interconnect capacitance

We present a new simulation tool for efficient extraction of 3D capacitance matrix in interconnect structures embedded in a multilayered dielectric environment. We use a fictitious domain method, which replaces the initial problem on a complex geometry by a problem on a simple shape domain embedding the initial domain, and is consequently ideally suited for the treatment of complex geometries. Numerical results confirm that this method is more efficient, both in CPU time and memory, than a finite elements or a boundary elements method.