Title :
3-D Micro Electro Magnetic Radio Frequency Systems (3-D MERFS) and other DARPA RF MEMS Programs
Author_Institution :
Defense Adv. Res. Projects Agency, Anaheim, CA
Abstract :
The Defense Advanced Research Projects Agency (DARPA), Microsystem Technology Office (MTO) currently sponsors a number of efforts to improve the performance of radio frequency (RF) systems using micro electromechanical systems (MEMS) technology. These include the 3-dimensional micro electromagnetic radio frequency systems (3-D MERFS), analog spectral processors (ASP), and harsh environment robust micromechanical technology (HERMIT), and micro cyrogenic coolers (MCC). In this talk, Dr. Evans provides an overview of these four efforts, focusing specifically on recent advances in the 3-D MERFS program
Keywords :
micromechanical devices; radiofrequency integrated circuits; 3D MERFS; 3D micro electro magnetic radiofrequency systems; ASP; DARPA RF MEMS programs; Defense Advanced Research Projects Agency; HERMIT; MCC; MEMS technology; MTO; Microsystem Technology Office; analog spectral processors; harsh environment robust micromechanical technology; micro cyrogenic coolers; microelectromechanical systems; Attenuation; Conductors; Copper; Couplers; Dielectrics; Micromechanical devices; Radio frequency; Radiofrequency microelectromechanical systems; Testing; Transmission lines;
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2006. CSIC 2006. IEEE
Conference_Location :
San Antonio, TX
Print_ISBN :
1-4244-0126-7
Electronic_ISBN :
1-4244-0127-5
DOI :
10.1109/CSICS.2006.319959
