Title :
Vapour phase soldering on flexible printed circuit boards
Author :
Geczy, Attila ; Batorfi, Reka ; Szeles, Gergely ; Luhaly, Adam ; Ruszinko, Miklos ; Berenyi, Richard
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
The paper presents experimental results about Vapour Phase Soldering on flexible printed circuit boards, where the standard Surface Mounted Technology process was used for investigation. Test boards were prepared from FR4 type Printed Circuit Boards and single-sided flexible polyimide substrates. Lead-free SAC305 paste and different chip size surface mounted resistors were used for the test assembly. The soldering was performed with heat-level vapour phase method in a commercial oven. The tests were composed of different board setups: where the FR4 or the flexible boards were soldered without fixtures, and where the flexible boards were supported by fixtures. The results were evaluated with X-ray microscopy, cross-section optical inspection (IMC tests) and shear tests. The conclusion reveals similar quality factors in all cases, rendering vapour phase soldering a plausible alternative reflow method for soldering on flexible printed circuit boards
Keywords :
X-ray microscopy; flexible electronics; printed circuit manufacture; printed circuit testing; reflow soldering; surface mount technology; FR4 type printed circuit boards; IMC tests; X-ray microscopy; chip size surface mounted resistors; cross-section optical inspection; flexible polyimide substrates; flexible printed circuit boards; heat-level vapour phase method; lead-free SAC305 paste; reflow method; shear tests; surface mounted technology; test assembly; test boards; vapour phase soldering; Fixtures; Flexible printed circuits; Heat transfer; Heating; Joints; Materials; Soldering; Flexible; Printed Circuit Board; Vapour Phase Soldering; polyimide;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location :
Bucharest
DOI :
10.1109/SIITME.2014.6966996
