DocumentCode
164670
Title
A new high frequency ultrasonic SONAR head for airborne applications
Author
Aiordachioaie, Dorel ; Epure, Silviu ; Dumitrascu, Bogdan
Author_Institution
Dept. of Electron. & Telecommun., Dunarea de Jos Univ. of Galati, Galati, Romania
fYear
2014
fDate
23-26 Oct. 2014
Firstpage
95
Lastpage
98
Abstract
The paper presents a new version of the ROVIBAT (ROmanian VIrtual BAT) sonar head, based on airborne transducer module (ATM) with five discrete frequencies (40, 125, 200, 228 and 300 kHz). The sonar head is used for navigation of the robots and for ultrasonic image generation of the explored environment. The previous versions of the ROVIBAT heads, i.e. 00 to 04, have used a single working frequency (40 kHz). At each single frequency, an airborne ultrasonic image is obtained. The obtained image is not very rich in information, especially concerning the size and the type of the target´s surface. The final goal of the new sonar head is to improve the quality of the ultrasonic images by exploring multispectral image fusion techniques. Such fused images will be more useful for detection and classifying the contours and textures of the explored targets. The fixed frequency ultrasonic transducers from previous versions are replaced now by an airborne transducer module (ATM), which contains all five transducers. The characteristics of the module and the solution used to integrate this element in the structure of the ROVIBAT sonar head are presented and discussed in this work.
Keywords
aircraft instrumentation; image fusion; sonar detection; ultrasonic transducers; virtual instrumentation; ROVIBAT sonar head; Romanian virtual bat sonar head; airborne applications; airborne transducer module; high frequency ultrasonic sonar head; multispectral image fusion techniques; ultrasonic image generation; ultrasonic transducers; Acoustics; Head; Resonant frequency; Sonar; Sonar navigation; Transducers; Ultrasonic transducers; Ultrasonic transducers; biomimetic; electronic circuits; sonar;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location
Bucharest
Type
conf
DOI
10.1109/SIITME.2014.6967001
Filename
6967001
Link To Document