Title :
Design of circular beat spreaders on semi-infinite heat sinks in microelectronics device applications
Author :
Hui, P. ; Tan, H.S. ; Lye, Y.S.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Abstract :
Using the rigorous analytical solutions, we discuss design aspects in terms of thermal resistance and temperature uniformity for the canonical heat dissipation configuration consisting of a circular heat spreader on a semi-infinite heat sink. Regarding the optimized size of the heat spreader, we have found that the minimum temperature thickness of the spreader depends on the thermal conductivity values of the spreader and the sink, in contrast to the results published previously by other researchers. In addition, a new design formula d=0.446 for the selection of spreader thickness d from the spreader radius b is proposed to replace the commonly used rule d=b/3. Our results have confirmed the design rule b=5a for the selection of the spreader radius b from a given heat source radius a. To facilitate the complete design of the heat spreaders, we present two nomographs in the form of contour plots for the normalized thermal resistance and the normalized temperature uniformity
Keywords :
heat sinks; nomograms; semiconductor device packaging; thermal conductivity; thermal resistance; canonical heat dissipation configuration; circular beat spreaders; contour plots; heat source radius; microelectronics device applications; nomographs; semi-infinite heat sinks; temperature uniformity; thermal conductivity values; thermal resistance; Electronic packaging thermal management; Heat engines; Heat sinks; Heat transfer; Integrated circuit modeling; Microelectronics; Resistance heating; Temperature distribution; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3793-X
DOI :
10.1109/STHERM.1997.566801
