Minimization of passive circuits losses realized on low resistivity silicon using micro-machining techniques and thick polymer layers

In this paper, a novel technological solution using both silicon surface micromachining and thick polymer layer deposition on low resistivity silicon substrate (20 /spl Omega//cm) has been investigated. The proposed structure achieves both a low attenuation level and a high quality factor. The silicon etching into the coplanar slots leads indeed to a noticeable decrease of the losses, whereas filling the gaps with the polymer BCB avoids a degradation of the effective permittivity.