DocumentCode
1646846
Title
A study on treeing breakdown and fractal characteristics according to method of acoustic emission detection in high polymer
Author
Kim, Jae-Hwan ; Sin, Sung-Kwon ; Sim, Jung-Tag ; Kwon, Byong-Hui ; Baek, Kwan-Hyon ; Ka, Chul-Hyon
Author_Institution
Kwangwoon Univ., Seoul, South Korea
Volume
1
fYear
1997
Firstpage
434
Abstract
In this study, in order to observe treeing deterioration and tree shape in relation to fractal dimension, acoustic emission properties due to growth of tree in Polymer was investigated by using the measuring system of AE under AC voltage. The generated tree was photographed with a camera through a microscope. The obtained photograph was digitized by using a scanner and image processed with a personal computer. After that, the tree length was measured and then the fractal dimension of tree was calculated in using a scale covering method. And growing shape of tree was quantified in using fractal characteristics. To examine relation among growing shape of tree and characteristics of fractal in tree shape (tree type and bush type) was increased with increment of applied AC, AE pulse number and mean amplitude were increased along with near breakdown rather than tree initiation. While AE pulse number and mean amplitude were promoted, fractal was slowly increased with tree growth. Fractal dimension in accord to applied voltage was slowly increased, the results show that there is a relationship between characteristics of AE and fractal dimension
Keywords
acoustic emission; fractals; organic insulating materials; polymers; trees (electrical); AE mean amplitude; AE pulse number; HV insulation; acoustic emission detection; camera; digitized photograph; fractal dimension; high polymer; image processing; microscope; personal computer; scale covering; scanner; treeing breakdown; Acoustic emission; Acoustic measurements; Cameras; Electric breakdown; Fractals; Microcomputers; Microscopy; Polymers; Shape measurement; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on
Conference_Location
Seoul
Print_ISBN
0-7803-2651-2
Type
conf
DOI
10.1109/ICPADM.1997.617629
Filename
617629
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