Title :
Kinetics parameters studies of Co-Fe-B deposits using multiple regression
Author :
He, Hua Hui ; Liu, Chang Hui ; Shen, Xiang ; Li, Hai Hua
Author_Institution :
Dept. of Electron. Sci. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
A mathematics model based on multiple linear regression (MLR) for the deposition rate of the electroless Co-Fe-B thin film was established. The plating rate of electroless Co-Fe-B deposits is a function of concentration of sodium tetrahydroborate, pH of the plating bath, plating temperature and the metallic ratio. The correlation of deposition rate and the solution concentration and pH value shown in experimental data was described by residual variance S. The estimated regression coefficient b0-3, confidence interval, residual error r and confidence interval rint were ascertained by computer program. The best kinetics equation of deposition rate was derived. The optimal composition of the plating bath was obtained according to experimental results and reaction kinetics equation. In this paper, all kinds of complexing agent and linear regression analysis ware adopted so as to optimize experimental project. Meanwhile, the optimal composition of the plating solution and operating conditions ware obtained, and Co-Fe-B alloy thin film of good quality was fully produced.
Keywords :
boron alloys; cobalt alloys; electroless deposition; electroplating; iron alloys; metallic thin films; pH; regression analysis; CoFeB; MLR; deposition rate correlation; electroless thin film; kinetics parameter; multiple linear regression analysis; pH value; plating bath composition; regression coefficient; Boron alloys; Cobalt; Equations; Iron; Kinetic theory; Linear regression; Magnetic films; Plastic films; Saturation magnetization; Sputtering; Co-Fe-B ternary alloy; Deposition rate; Electroless deposition; Kinetics equation; Multiple regression; computer program;
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2005. MAPE 2005. IEEE International Symposium on
Print_ISBN :
0-7803-9128-4
DOI :
10.1109/MAPE.2005.1618205