• DocumentCode
    1646955
  • Title

    Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow

  • Author

    Teertstra, P. ; Yovanovich, M.M. ; Culham, J.R.

  • Author_Institution
    Dept. of Mech. Eng., Waterloo Univ., Ont., Canada
  • fYear
    1997
  • Firstpage
    238
  • Lastpage
    246
  • Abstract
    An analytical model is presented that predicts pressure loss for fully developed flow in a parallel plate channel with an array of uniformly-sized and spaced cuboid blocks on one wall. The model is intended for use in optimizing enclosure designs for air cooled electronics equipment containing arrays of printed circuit boards. Using a composite solution, based on the laminar and turbulent smooth wall channel limiting cases, the friction factor for periodic fully developed flow can be calculated as a function of the array geometry and fluid velocity. The resulting model is applicable for a full range of Reynolds numbers, 1⩽Re(Dk)⩽100000. Average differences between the model and the results available in the literature are 5% and 15% for numerical laminar flow data and measured values, respectively
  • Keywords
    channel flow; cooling; forced convection; printed circuit design; surface mount technology; Reynolds numbers; air cooled electronics equipment; array geometry; channel flow; cuboid blocks; enclosure designs; fluid velocity; friction factor; laminar wall channel; parallel plate channel; pressure loss modeling; printed circuit board arrays; surface mounted cuboid-shaped packages; turbulent smooth wall channel; Design optimization; Fluid flow measurement; Friction; Geometry; Heat transfer; Loss measurement; Microelectronics; Packaging; Pressure measurement; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-3793-X
  • Type

    conf

  • DOI
    10.1109/STHERM.1997.566802
  • Filename
    566802