DocumentCode :
1646955
Title :
Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow
Author :
Teertstra, P. ; Yovanovich, M.M. ; Culham, J.R.
Author_Institution :
Dept. of Mech. Eng., Waterloo Univ., Ont., Canada
fYear :
1997
Firstpage :
238
Lastpage :
246
Abstract :
An analytical model is presented that predicts pressure loss for fully developed flow in a parallel plate channel with an array of uniformly-sized and spaced cuboid blocks on one wall. The model is intended for use in optimizing enclosure designs for air cooled electronics equipment containing arrays of printed circuit boards. Using a composite solution, based on the laminar and turbulent smooth wall channel limiting cases, the friction factor for periodic fully developed flow can be calculated as a function of the array geometry and fluid velocity. The resulting model is applicable for a full range of Reynolds numbers, 1⩽Re(Dk)⩽100000. Average differences between the model and the results available in the literature are 5% and 15% for numerical laminar flow data and measured values, respectively
Keywords :
channel flow; cooling; forced convection; printed circuit design; surface mount technology; Reynolds numbers; air cooled electronics equipment; array geometry; channel flow; cuboid blocks; enclosure designs; fluid velocity; friction factor; laminar wall channel; parallel plate channel; pressure loss modeling; printed circuit board arrays; surface mounted cuboid-shaped packages; turbulent smooth wall channel; Design optimization; Fluid flow measurement; Friction; Geometry; Heat transfer; Loss measurement; Microelectronics; Packaging; Pressure measurement; Printed circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX
ISSN :
1065-2221
Print_ISBN :
0-7803-3793-X
Type :
conf
DOI :
10.1109/STHERM.1997.566802
Filename :
566802
Link To Document :
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