Flow simulations for ccomponent spacing optimization on PCB boards

The paper focuses on analyzing component placement on a PCB board. The study was done with SolidWorks simulations to analize the air flow on the surface of a PCB, equipped with two components, heated at 40 Celsius degrees. The spacing between components and their position were varied, in order to see what the optimal configuration for better cooling the assembly is. The first set of simulations were comprised of a set of generic components, modeled with cubic shapes, and were replaced with DPACK components, a package that is most used for electronic components that generate large quantities of energy. Test results show that the distance between components has a significant impact on cooling capabilities, in case an air flow exists.