DocumentCode :
1647042
Title :
AlGaN/GaN HEMT on Diamond Technology Demonstration
Author :
Jessen, G.H. ; Gillespie, J.K. ; Via, G.D. ; Crespo, A. ; Langley, D. ; Wasserbauer, J. ; Faili, F. ; Francis, D. ; Babic, D. ; Ejeckam, F. ; Guo, S. ; Eliashevich, I.
Author_Institution :
AFRL, WPAFB
fYear :
2006
Firstpage :
271
Lastpage :
274
Abstract :
This letter is a first report on the operation of AlGaN/GaN high-electron mobility transistors (HEMTs) atomically attached to a CVD diamond substrate. This technology demonstration shows the feasibility of producing GaN based devices on polycrystalline CVD diamond substrates to maximize heat extraction from devices operating at high power by situating the diamond substrates in the immediate proximity of the transistor channel. Such an approach offers tremendous opportunity for efficient and effective heat management of high power devices. We demonstrate the ability to preserve the electrical properties of AlGaN/GaN HEMTs throughout the GaN-on-diamond atomic attachment process and report on the fabricated DC and small-signal HEMT characteristics
Keywords :
III-V semiconductors; aluminium compounds; chemical vapour deposition; diamond; electric properties; gallium compounds; high electron mobility transistors; thermal management (packaging); wide band gap semiconductors; AlGaN-GaN; AlGaN/GaN HEMT; AlGaN/GaN high-electron mobility transistors; GaN based devices; GaN-on-diamond atomic attachment process; diamond technology demonstration; electrical properties; heat extraction; heat management; high power devices; polycrystalline CVD diamond substrates; Aluminum gallium nitride; FETs; Gallium nitride; HEMTs; Silicon; Substrates; Temperature; Thermal conductivity; Thermal management; Thermal resistance; GaN; diamond; high electron mobility transistor (HEMT); power; wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2006. CSIC 2006. IEEE
Conference_Location :
San Antonio, TX
Print_ISBN :
1-4244-0126-7
Electronic_ISBN :
1-4244-0127-5
Type :
conf
DOI :
10.1109/CSICS.2006.319952
Filename :
4110039
Link To Document :
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