Title :
A 100-GHz distributed amplifier in chip-size package
Author :
Masuda, S. ; Kobayashi, K. ; Kira, H. ; Kitajima, M. ; Takesue, M. ; Kamiya, Y. ; Joshin, K.
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
Abstract :
We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3 dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.
Keywords :
MIMIC; MMIC amplifiers; chip scale packaging; distributed amplifiers; flip-chip devices; millimetre wave amplifiers; wideband amplifiers; 100 GHz; 110 GHz; 7.8 dB; 97 GHz; EHF; MM-wave chip scale package; flip-chip distributed amplifier; inverted microstrip lines; millimeter-wave CSP; plastic CSP; thin-film substrate; Assembly; Bandwidth; Chip scale packaging; Distributed amplifiers; MMICs; Millimeter wave technology; Millimeter wave transistors; Plastics; Resins; Substrates;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1212544
