Title :
Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers
Author :
Heyen, J. ; Kerssenbrock, T.V. ; Chernyakov, A. ; Heide, P. ; Jacob, A.F.
Author_Institution :
Inst. fur Hochfrequenztech., Technische Univ. Braunschweig, Germany
Abstract :
This paper demonstrates advanced packaging concepts for highly integrated encapsulated millimeter-wave modules. Millimeter-wave monolithic integrated circuits (MIMIC) are flip-chip mounted on top of a LTCC package (low temperature co-fired ceramic). This type of "smart package" can integrate all kinds of passive functions as well as compact interconnections between MIMIC and vertical feedthroughs. The bottom side of this package is connected via a standard ball grid array (BGA) to a low-cost laminate PCB serving as motherboard for multiple LTCC modules. Fabricated LTCC test structures and LTCC test packages provide good performance up to about 30 GHz.
Keywords :
MIMIC; ball grid arrays; ceramic packaging; encapsulation; flip-chip devices; microassembling; modules; printed circuit manufacture; transceivers; 30 GHz; BGA modules; LTCC packaging; MIMIC; ball grid arrays; encapsulated millimeter-wave modules; flip-chip mounting; integrated mm-wave transceivers; laminate PCB motherboards; low temperature co-fired ceramic; millimeter-wave monolithic integrated circuits; multiple LTCC modules; smart package passive functions/compact interconnections; vertical feedthroughs; Ceramics; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Laminates; MIMICs; Millimeter wave integrated circuits; Temperature; Testing; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1212547
