Title :
Via arrays for grounding in multilayer packaging - frequency limits and design rules
Author :
Tischler, T. ; Rudolph, M. ; Kilk, A. ; Heinrich, W.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochsfrequenstech. (FBH), Berlin, Germany
Abstract :
Many packaging concepts use via arrays for grounding and to eliminate parasitic modes. Such arrays represent periodic structures and change their behavior beyond a certain frequency. Proper design of via geometry and pitch is necessary. For this purpose, electromagnetic simulation data and an equivalent circuit model are presented.
Keywords :
MMIC; arrays; earthing; equivalent circuits; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microstrip lines; periodic structures; FDTD method; GaAs; GaAs MMIC; LTCC substrate; design rules; electromagnetic simulation data; equivalent circuit model; frequency limits; grounding; microstrip environment; mm-wave packaging; multilayer packaging; parasitic mode elimination; periodic structures; pitch design; via arrays; via geometry design; Ceramics; Circuit simulation; Equivalent circuits; Frequency; Gallium arsenide; Geometry; Grounding; Nonhomogeneous media; Packaging; Periodic structures;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1212571
