Title :
40 GHz hot-via flip-chip interconnects
Author :
Schmuckle, F.J. ; Jentzsch, A. ; Gassler, C. ; Marschall, P. ; Geiger, D. ; Heinrich, W.
Author_Institution :
Ferdinand-Braun-Inst. (FBH), Berlin, Germany
Abstract :
A hot-via flip-chip interconnect for the 40 GHz band is presented. The chip in-out cell includes on-wafer probing pads and is minimized with regard to size. An optimized design shows excellent performance with 10 GHz of bandwidth and -40 dB isolation. This demonstrates the potential of the hot-via approach in mm-wave applications.
Keywords :
MIMIC; coplanar waveguides; flip-chip devices; integrated circuit interconnections; microstrip lines; 10 GHz; 40 GHz; 40 GHz hot-via flip-chip interconnects; chip in-out cell; coplanar waveguide transmission-line element; microstrip designs; mm-wave applications; on-wafer probing pads; optimized design; parallel-plate line mode; size minimization; Bandwidth; Bonding; Chip scale packaging; Coplanar waveguides; Design optimization; Gallium arsenide; Geometry; Integrated circuit interconnections; Microstrip; Substrates;
Conference_Titel :
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location :
Philadelphia, PA, USA
Print_ISBN :
0-7803-7695-1
DOI :
10.1109/MWSYM.2003.1212576
