DocumentCode
1647880
Title
40 GHz hot-via flip-chip interconnects
Author
Schmuckle, F.J. ; Jentzsch, A. ; Gassler, C. ; Marschall, P. ; Geiger, D. ; Heinrich, W.
Author_Institution
Ferdinand-Braun-Inst. (FBH), Berlin, Germany
Volume
2
fYear
2003
Firstpage
1167
Abstract
A hot-via flip-chip interconnect for the 40 GHz band is presented. The chip in-out cell includes on-wafer probing pads and is minimized with regard to size. An optimized design shows excellent performance with 10 GHz of bandwidth and -40 dB isolation. This demonstrates the potential of the hot-via approach in mm-wave applications.
Keywords
MIMIC; coplanar waveguides; flip-chip devices; integrated circuit interconnections; microstrip lines; 10 GHz; 40 GHz; 40 GHz hot-via flip-chip interconnects; chip in-out cell; coplanar waveguide transmission-line element; microstrip designs; mm-wave applications; on-wafer probing pads; optimized design; parallel-plate line mode; size minimization; Bandwidth; Bonding; Chip scale packaging; Coplanar waveguides; Design optimization; Gallium arsenide; Geometry; Integrated circuit interconnections; Microstrip; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location
Philadelphia, PA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7695-1
Type
conf
DOI
10.1109/MWSYM.2003.1212576
Filename
1212576
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